Glossary | Advanced Fab Technology

Abbreviation

Expansion

AEM

Alarm Event Manager

AHMS

Analog and Digital inputs - DAQ sensors

Alarm Handling and Management System

APC

Advanced Process Control

AQV

Adequacy Quality Value. This indicator gives an idea of the values of the FDC data collected, compared to the values of the learning data set. AQV values range from 0. to 1, with lower values indicating that the present data set is further from the data space defined by the learning (training) data set. It is not given to the user.

Automated Features

Chamber

Context Type

Features of customer-delivered software that operate automatically as initiated by factory systems

Sub system of tool

Context items are categorical information that defines a wafer / lot’s processing history. For instance, a given wafer’s context type of Tool ID may have a value of Etch03 at a given process operation

C V

Control Variable, the value that has a control objective (target or set point). Typically this is a measured value. Examples include thickness and critical dimension.

CPCE (YA-SW+DB)

Central Process Control Executor

Defectivity. Acronym for “Defectivity Zero”

Data source: SVID…equipment status variable (SEC/GEM or HSMS

Equipment

DCQ

DCQV

Defectivity

Data Collection

Data Collection Quality

Measure resulting from analysis of wafer yield loss

Data Collection Quality Value

Tool

Equipment Group

A set of tools sharing same model and configurations

E Q V

Estimation Quality Value. This indicator gives the estimated confidence of the prediction for each predicted value and is related to the variance of learning data nearest to the input data used for the prediction. EQV varies between 0 and 1, with lower values indicating lower confidence in the prediction. It is not given to the user.

External Sensor (TCP IP, modeBus, etc)E Q V

F D C

Fault Defection and classification

F R

Failure Rate

Gateway

Set of SW to communicate between fab equipments and YA-FDC system

G E M

(Graphics Environment Manager) A graphical user interface from Digital Research that was similar to the Mac/Windows environment. It was built into ROM in several Atari computers. The DOS version of Ventura Publisher came with a runtime version of GEM.

Goodness of Fit, GOF

A parameter provided by the metrology tool as a quality estimate associated with measurements

Indicator

Statistics (max,min,median,etc) computed on selected window of sensor temporal data

Statistics to be applied to raw trace window to build indicator = max,min,mean,median,stdev,mange,maxSlope,minSlope,etc

Indicator Stats

Indicators of Interest

The set of indicators selected by off-line analysis as the inputs to a YA-FDC or Metrology Predictor model

IInfluential Indicators

See “indicators of interest”

Integrated Metrology

Metrology tool that is mounted directly on process tool, with higher wafer sampling and different automation interface requirements than is typical for a stand-alone metrology tool

IOI

Indicators of Interest

Key Indicators

See “indicators of interest”

Knowledgebase

Large intended database containing collaborative learnings on equipment and sensors

Layer

A specific grouping of processes, as specified by User, that produce a patterned layer on the semiconductor product substrate Layers have a specific sequence relationship with each other.

Layer Model

A specific model that applies to predicting yield / D0 / FR at a given layer. For instance, Metal 2 edge die opens may be a specific model that applies to the Metal 2 layer

Layer Module

The set of all models that apply to predicting yield / D0 / FR at a given layer. For instance, the Metal 2 Layer Module may consist of models for Metal 2 edge die opens, Metal 2 center die opens, Metal 2 edge die short and Metal 2 edge die short

Layer ID

An alphanumeric value used to identify a layer

Learning Data Set

Set of data used to create a model, sometimes called “training data”.

Limited Yield

Yield associated with a subset of the entire production operation. Final yield can be calculated by multiplying together all limited yields

Mashing

MES Context

MES

Mapping between sensor and wafer

Manufacturing Execution System=FAB host to control wafer processing and equipment utilization

Manufacturing Execution System, a logistics software system that tracks and directs product throughout the manufacturing process.

Items used to select R2R strategy, typical minimal set is LotID, ToolID, OperationID

Metrology Estimate

YA Metrology Predictor estimated metrology values

Univariate modeling for excursions

Micro Modeling

Model Recalibration

A change to an existing model that uses additional data instead of or in addition to all or part of the original learning data se t to re-train (or regress again, identify again) the model so that the model more accurately applies to the current process operation

Model Redefinition

An augmentation of an existing model to make the model more accurate by adding and /or substracting from the existing indicator set and calibrating this newly defined model

Model Update

A change to an existing model including one or both of Model Recalibration and Model Redefinition

Module Monitoring

Semiconductor manufacturing information system(s) providing the detection, notification and classification of faulty process operation to assure manufacturing process quality. FDC and SPC are both monitoring systems.

Multivariate

Model Quality Value=quantitative measure of model confidence

MQV

Model Quality Value, indicates the quality of model predictions as compared to observed values. MQV varies between 0 and 1, with the lower values indicating a larger difference

Multiple dimention equation to predict/resolve response

Neighbors

Indicators with direct correlation to each other

OEE

Off-line

Off-line Tools

Off-line Features

Online

Overall Equipment Efficiency

Realtime (or technically close to) data collection and detection of equipment fault

See Off-line Features and Off-line Tool definitions

Functions of the software delivered to customers that is user interactive and not executed automatically.

The set of software tools that are used by PDF engineering for model definition and update

Operation

A manufacturing step, almost always associated with processing product on either a process tool or a metrology tool.

A single manufacturing process step (see step)

Parameter

Operation

Sensor

Measurements on electrical test structures, typically voltages, currents, resistance, capacitance or frequency, used to characterize the quality of manufactured microelectronic product

Parametric Test (PT)

PCA

PCA (Statistic)

PCA (YA-SW)

Principal Component Analysis

Process Control Analysis

Process Control Builder

PCB (YA-SW)

PCD (YA-SW)

dataPower bridge from and to Maestria

PCE (YA-SW)

PFT

dProcess Control Executor

ProcessFlowTask is a unique combination of Process+Equipment+Chamber+Recipe

Predicted Metrology Extreme=Random forest algorithm for multivariate modeling

PMX

PQV

Prediction Quality Value is a weighted average of the AQV and the EQV, provided to Users as a quality indicator of each model-predicted value. PQV varies between 0 and 1, with lower PQV indicating lower quality of the model-predicted value.

Production Software

The set of product software that is delivered to the customer for use in fab production

Raw data

Data set consisting of process tool signals at time intervals over the course of the execution of the process recipe. Also called temporal data or trace data.

Temporal Sensor readings

Raw Trace

Recalibration

Recipe

Recipe Steps

See Model Recalibration

Process recipe

Substeps within process recipe

Redefinition

See Model Redefinition

Response

Robustness means you have to test what you learned. This mean you have to divide….Learning Vs Test Data set…(need to anchor the # of wafers and response type Iis decided in modeling)…some where.)

Value(s) to be modeled (FR, metrology, PCM, etc)

Robustness

ScribeID

SECS/GEM

SiView

Slot

SSA

StepID

Strategy

tool group

Trace Data

Temporal Data

Unsupervised FDC

Supervised FDC

USG

Technology

Univariate

Configuration table to contain definition of PFT+Parameters+Indicators. Example

Unique code (usually) laser printed on the wafer to describe waferID)

(SEMI Equipment Communications Standard/Generic Equipment Model) Communications protocols between a host computer and semiconductor manufacturing equipment. SECS is a layer 6 protocol that describes the content of the messages while GEM is a higher layer application protocol that defines the messages themselves. SECS/GEM is used to control wafer steppers, lithographic equipment, etchers, ion implanters and other machines

IBM version of MES

Wafer position within wafer cassette (1-25)

Spatial Signature Analysis (part of FSDA)

Recipe step number

Model based FDC

A category of production method that includes a specification of associated Layers, Processes and Products. Often described by the process critical dimension, as in “65 nm technology”.

Data set consisting of process tool signals at time intervals over the course of the execution of the process recipe. Also called temporal data or raw data.

Data set consisting of process tool signals at time intervals over the course of the execution of the process recipe. Also called trace data or raw data.

One dimemtion equation to predict/resolve response

Conventional FDC

Undoped Silicate Glass

Virtual Metrology=model metrology as response and action based on predictions

VM, Virtual Metrology

“Virtual Metrology”, equivalent to Predictive Metrology, a method of estimating metrology tool measurements based on process tool data

YAFDC

Yield

Window(ing)

Yield-Aware Alarm

Specific duration within temporal sensor reading to compute statistics

Acronym for Yield Aware

Virtual PCM=model parametric as response and action based on predictions

Yield Aware FDC

Quality metric that results from the integrated effect of all manufacturing processes; associated with the ultimate economic value of the manufactured product

Message sent by YA-FDC to Fab Alarm Handling System with notification of YA-Limits violation